Semiconductor package (EBGA)
A semiconductor package that supports miniaturization and high density through unique cavity structure formation technology.
Our "Semiconductor Package (EBGA)" responds to miniaturization and high density through the adoption of unique cavity structure formation technology, fine pattern formation technology, and electroless gold plating technology. Using our proprietary method, we manufacture packages with a three-dimensional cavity structure. It is also possible to directly replace the cavity structure of a ceramic substrate with a glass-epoxy substrate. Furthermore, by implementing functional components in the cavity section, internal component embedding is possible. This allows for shorter signal propagation distances, making it effective for high-speed processing. 【Features】 ■ Unique cavity formation technology ■ Supports miniaturization and high density ■ Effective for high-speed processing ■ Can use the substrate surface as the mounting surface in combination with build-up ■ Produces high-speed processing packages by bonding metal heat spreaders *For more details, please refer to the catalog or feel free to contact us.
- Company：日本ミクロン
- Price：Other
